• DocumentCode
    2471821
  • Title

    6D-5 Modeling the Rf Acoustic Behavior of Love-Wave Sensors Loaded with Organic Layers

  • Author

    Fissi, L. El ; Friedt, J.-M. ; Ballandras, S.

  • Author_Institution
    SENSeOR, Sophia Antipolis
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    484
  • Lastpage
    487
  • Abstract
    In order to exploit complicated combinations of measurements associated with acoustic devices, we present the results of finite element/boundary element analyses including visco-elastic losses on fluid-loaded love-wave based devices, used as microbalance for biochemical detection and sensing purposes. The P-matrix characteristics of the mode are extracted from these computations to simulate the implemented devices. The corresponding frequency dependent phase shift and acoustic losses are introduced in the P-matrix model, allowing for an accurate prediction of insertion losses and phase sensitivity of our love-wave delay lines. Comparison between theory and experiments shows that we are capable to accurately predict the influence of viscosity on the insertion losses of the love-wave microbalance.
  • Keywords
    Love waves; VHF devices; acoustic delay lines; acoustic transducers; biochemistry; biosensors; boundary-elements methods; finite element analysis; losses; microbalances; organic compounds; viscoelasticity; viscosity; Love-wave microbalance; Love-wave sensors; P-matrix characteristics; RF acoustic behavior modeling; acoustic losses; biochemical detection; biochemical sensing applications; boundary element analysis; finite element analysis; fluid-loaded love-wave based devices; insertion losses; love-wave delay lines; organic layers; phase sensitivity; visco-elastic losses; viscosity; Acoustic devices; Acoustic measurements; Acoustic sensors; Acoustic signal detection; Biochemical analysis; Biosensors; Finite element methods; Insertion loss; Loss measurement; Sensor phenomena and characterization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.130
  • Filename
    4409703