DocumentCode :
2471919
Title :
6F-3 Fabrication and Assembly of a Monolithic 3D CMUT Array for Imaging Applications
Author :
Cheng, Xiaoyang ; Chen, Jingkuang ; Shen, I-Ming ; Li, Pai-Chi ; Wang, Mengli
Author_Institution :
Univ. of New Mexico, Albuquerque
fYear :
2007
fDate :
28-31 Oct. 2007
Firstpage :
515
Lastpage :
518
Abstract :
This paper describes a novel architecture for integration of polysilicon capacitive micromachined ultrasonic imager array on a 3D hexagonal silicon platform for simultaneous multi-directional viewing. Integrated with seven CMUT arrays oriented at seven different directions, this three-dimensional hexagonal imager prism is capable of viewing the front direction and 360deg side directions concurrently. The seven CMUT-array plates were monolithically fabricated on one silicon substrate using a surface micromachining process. The silicon substrate under the connection areas between the imager plates was then completely etched away using a selective backside deep silicon etching, leaving behind flexible dielectric films for inter-plate connection. In addition to providing mechanical linkage, these dielectric connecting films also support the thin-film electrical interconnects between the imagers on different plates. The seven CMUT arrays were then folded into a miniature prism and glued together using epoxy. Hexagonal imager prisms with width across corner of the hexagon, ranging from 500 mum to 4 millimeters in width, and 2 to 4 millimeters in length have been prototyped and tested. The CMUT devices behaved consistently before and after the assembly process. This architecture allows one monolithically integrated or flip-chip bonded beam-forming circuit to control all the imagers on this miniature prism and the number of bonding wires can be minimized. The multi- direction viewing capability and miniature size make this device capable of delivering more comprehensive information for internal medical imaging applications.
Keywords :
biomedical transducers; biomedical ultrasonics; capacitive sensors; dielectric thin films; elemental semiconductors; etching; flip-chip devices; image sensors; microassembling; microsensors; silicon; ultrasonic transducer arrays; 3D hexagonal silicon; Si; assembly process; beam-forming circuit; flexible dielectric films; flip-chip bonding; hexagonal imager prisms; inter-plate connection; internal medical imaging; mechanical linkage; monolithic 3D CMUT image array fabrication; polysilicon capacitive micro-machined ultrasonic transducers; selective backside deep silicon etching; simultaneous multidirectional viewing; thin-film electrical interconnects; Assembly; Bonding; Dielectric films; Dielectric substrates; Dielectric thin films; Etching; Fabrication; Millimeter wave devices; Silicon; Ultrasonic imaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2007. IEEE
Conference_Location :
New York, NY
ISSN :
1051-0117
Print_ISBN :
978-1-4244-1384-3
Electronic_ISBN :
1051-0117
Type :
conf
DOI :
10.1109/ULTSYM.2007.136
Filename :
4409709
Link To Document :
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