• DocumentCode
    2472145
  • Title

    Dielectric properties of 3D composite structures: Simulations versus experiments

  • Author

    Serdyuk, Yu.V. ; Podoltsev, A.D. ; Gubanski, S.M.

  • Author_Institution
    Dept. of Electr. Power Eng., Chalmers Univ. of Technol., Gothenburg, Sweden
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    142
  • Lastpage
    145
  • Abstract
    Results of numerical simulations of the dielectric properties of binary composites with three-dimensional structures are verified by means of comparison with experimentally obtained data. Two different heterogeneous structures - regular (periodic) and stochastic, were studied. Frequency dependencies of the complex dielectric permittivities of the materials of the constituent phases of the composites were measured and were used as input for computer modelling together with their known geometrical parameters. Calculations were based on the effective media approach, and the associated field problem was solved numerically using the finite-volume method and the finite-element method. The results of the measurements and the computations of the effective complex permittivities of the composite materials are compared and are analysed.
  • Keywords
    composite materials; dielectric materials; finite element analysis; finite volume methods; permittivity; binary composite material; complex permittivity; computer model; dielectric properties; effective medium model; finite element method; finite volume method; frequency dependence; heterogeneous structure; numerical simulation; periodic structure; stochastic structure; three-dimensional structure; Composite materials; Dielectric materials; Dielectric measurements; Frequency measurement; Numerical simulation; Periodic structures; Permittivity measurement; Phase measurement; Solid modeling; Stochastic processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
  • Print_ISBN
    0-7803-7502-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2002.1048756
  • Filename
    1048756