DocumentCode
2472156
Title
Simulations of partial discharges of small microcracks parallel to the electrical field in polymeric materials
Author
Burgener, H.-P. ; Teich, T.H. ; Fröhlich, K.
Author_Institution
High Voltage Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
fYear
2002
fDate
2002
Firstpage
146
Lastpage
150
Abstract
Gaseous voids in polymeric dielectric materials are likely locations for partial discharges (PD). Numerous parameters influence the development of the charge avalanche. To date, various experiments and simulations have been carried out to investigate the PD behaviour as a function of the geometry of disc-shaped or spherical voids. In contrast, this paper deals with the restricting effect of the walls of cylindrical voids parallel to the electrical field on the avalanche. Simulations of the inception voltage and the apparent charge in longish cylindrical voids of constant length show increased inception voltage and decreasing apparent PD charge when the diameter of the void is reduced. These simulation results could be supported by experiments. To assess this, the diameter of drilled holes in epoxy resin was increased stepwise from 50 to 300 μm with a constant hole depth of 300 μm. For each diameter partial discharges were measured optically and electrically. The knowledge of the critical (sufficient) size of a void for PD to take place under given field conditions helps to formulate the requirements for the manufacturing processes for improved dielectric materials.
Keywords
dielectric materials; microcracks; partial discharges; polymers; voids (solid); apparent charge; charge avalanche; cylindrical void; electric field; epoxy resin; inception voltage; manufacturing process; microcrack; numerical simulation; partial discharge; polymeric dielectric material; Dielectric materials; Dielectric measurements; Electric variables measurement; Epoxy resins; Geometry; Manufacturing processes; Partial discharges; Polymers; Solid modeling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
Print_ISBN
0-7803-7502-5
Type
conf
DOI
10.1109/CEIDP.2002.1048757
Filename
1048757
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