• DocumentCode
    2472227
  • Title

    Efficient escape routing for hexagonal array of high density I/Os

  • Author

    Shi, Rui ; Chunq-Kuan Chenq

  • Author_Institution
    Dept. of Comput. Sci. & Eng., California Univ., San Diego, CA
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    1003
  • Lastpage
    1008
  • Abstract
    The chip/package I/Os count has continuously been growing as the systems become more complicated. High density I/Os interconnection and efficient escape routing with high performance and low cost will greatly benefit the whole electronic system. We analyze the properties of the hexagonal array, which can hold about 15% more I/Os compared with the traditional square grid array. We propose three escape routing strategies for the hexagonal array: column-by-column horizontal escape routing, two-sided horizontal/vertical escape routing, and multi-direction hybrid channel escape routing. We can escape I/Os in the hexagonal array in the same or less number of routing layers compared with square grid array. The practical examples show the efficiency of our strategies. Using hexagonal array, we can reduce the number of escape routing layers as well as increase the density of I/Os
  • Keywords
    integrated circuit design; integrated circuit interconnections; integrated circuit packaging; network routing; I/O count; escape routing strategy; hexagonal array; high density I/O interconnections; routing layers; Assembly; Computer science; Costs; Drives; Flip chip; Logic arrays; Operating systems; Packaging; Routing; Signal analysis; Algorithms; BGA; Design; Escape routing; Performance; flip chip; hexagonal array;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2006 43rd ACM/IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    0738-100X
  • Print_ISBN
    1-59593-381-6
  • Type

    conf

  • DOI
    10.1109/DAC.2006.229424
  • Filename
    1688945