DocumentCode
2472227
Title
Efficient escape routing for hexagonal array of high density I/Os
Author
Shi, Rui ; Chunq-Kuan Chenq
Author_Institution
Dept. of Comput. Sci. & Eng., California Univ., San Diego, CA
fYear
0
fDate
0-0 0
Firstpage
1003
Lastpage
1008
Abstract
The chip/package I/Os count has continuously been growing as the systems become more complicated. High density I/Os interconnection and efficient escape routing with high performance and low cost will greatly benefit the whole electronic system. We analyze the properties of the hexagonal array, which can hold about 15% more I/Os compared with the traditional square grid array. We propose three escape routing strategies for the hexagonal array: column-by-column horizontal escape routing, two-sided horizontal/vertical escape routing, and multi-direction hybrid channel escape routing. We can escape I/Os in the hexagonal array in the same or less number of routing layers compared with square grid array. The practical examples show the efficiency of our strategies. Using hexagonal array, we can reduce the number of escape routing layers as well as increase the density of I/Os
Keywords
integrated circuit design; integrated circuit interconnections; integrated circuit packaging; network routing; I/O count; escape routing strategy; hexagonal array; high density I/O interconnections; routing layers; Assembly; Computer science; Costs; Drives; Flip chip; Logic arrays; Operating systems; Packaging; Routing; Signal analysis; Algorithms; BGA; Design; Escape routing; Performance; flip chip; hexagonal array;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location
San Francisco, CA
ISSN
0738-100X
Print_ISBN
1-59593-381-6
Type
conf
DOI
10.1109/DAC.2006.229424
Filename
1688945
Link To Document