Title :
Efficient escape routing for hexagonal array of high density I/Os
Author :
Shi, Rui ; Chunq-Kuan Chenq
Author_Institution :
Dept. of Comput. Sci. & Eng., California Univ., San Diego, CA
Abstract :
The chip/package I/Os count has continuously been growing as the systems become more complicated. High density I/Os interconnection and efficient escape routing with high performance and low cost will greatly benefit the whole electronic system. We analyze the properties of the hexagonal array, which can hold about 15% more I/Os compared with the traditional square grid array. We propose three escape routing strategies for the hexagonal array: column-by-column horizontal escape routing, two-sided horizontal/vertical escape routing, and multi-direction hybrid channel escape routing. We can escape I/Os in the hexagonal array in the same or less number of routing layers compared with square grid array. The practical examples show the efficiency of our strategies. Using hexagonal array, we can reduce the number of escape routing layers as well as increase the density of I/Os
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit packaging; network routing; I/O count; escape routing strategy; hexagonal array; high density I/O interconnections; routing layers; Assembly; Computer science; Costs; Drives; Flip chip; Logic arrays; Operating systems; Packaging; Routing; Signal analysis; Algorithms; BGA; Design; Escape routing; Performance; flip chip; hexagonal array;
Conference_Titel :
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
1-59593-381-6
DOI :
10.1109/DAC.2006.229424