Title :
Formation of micro eaves analyzed by energy balance model at threefold of Cu film/DFR/Ni plating solution
Author :
Yoshida, Hideaki ; Nakamura, Tadashi ; Kawakami, Yoshialu ; Kawai, Akin
Author_Institution :
R&D Dept., Mitsubishi Mater. Corp., Hyogo, Japan
Abstract :
DFR (Dry Film Photoresist) is widely used mainly in micro plating process. However as the result of liquid intrusion into substrate/DFR interface, a bird\´s-beak like "eaves" is formed at bottom of a plating pattern. The purpose of this presentation is to clarify the mechanism of the "eaves" formation by analyzing adhesion energies at the substrate/DFR/liquids threefold.
Keywords :
adhesion; copper; electroplating; metallic thin films; nickel; photoresists; Cu film; Ni plating solution; adhesion; bird´s beak; dry film photoresist; energy balance model; micro-eaves; micro-plating process; substrate/DFR/liquid threefold interface; Adhesives; Electronic mail; Equations; Liquids; Optical microscopy; Research and development; Scanning electron microscopy; Shape; Spraying; Substrates;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2000 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-004-6
DOI :
10.1109/IMNC.2000.872636
