Novel organic bottom anti-reflective coating materials for 193 nm lithography

Author

Jung, Min-Ho ; Hong, Sung-Eun ; Jung, Jae-Chang ; Lee, Geunsu ; Koh, Cha-Won ; Kim, Jin-Soo ; Baik, Ki-Ho

Author_Institution

Memory R&D Div., Hyundai Electron. Ind. Co. Ltd., Kyoungki, South Korea

fYear

2000

fDate

11-13 July 2000

Firstpage

90

Lastpage

91

Abstract

We report the performance and compatibility of our new organic BARC materials (HEART004) designed to work for lithographic applications at 193 nm. The new organic BARC material has approximately an optical density of 12.1 /spl mu/m/sup -1/ at 193 nm. Its plasma etch rate is higher than that of ArF resists depending on the etch conditions. We evaluated typical two kinds of ArF resists on the organic BARCs, one is DHA1001 based on cycloolefin/maleic anhydride copolymer and the other is PAR710 based on acrylic copolymer. The PAR710 shows good compatibility with HEART004 at 210/spl deg/C of baking temperature.

Keywords

antireflection coatings; optical polymers; polymer blends; polymer films; ultraviolet lithography; 193 nm; ArF resist; DHA1001; DUV lithography; HEART004; PAR710; acrylic copolymer; cycloolefin/maleic anhydride copolymer; optical density; organic bottom anti-reflective coating; plasma etching; Coatings; Etching; Extinction coefficients; Lithography; Optical polymers; Organic materials; Plasma applications; Plasma density; Plasma materials processing; Resists;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology Conference, 2000 International

Conference_Location

Tokyo, Japan

Print_ISBN

4-89114-004-6

Type

conf

DOI

10.1109/IMNC.2000.872637

Filename

872637