DocumentCode
2472880
Title
Point injection in trench insulated gate bipolar transistor for ultra low losses
Author
Antoniou, M. ; Udrea, F. ; Bauer, F. ; Mihaila, A. ; Nistor, I.
Author_Institution
Dept. of Eng., Univ. of Cambridge, Cambridge, UK
fYear
2012
fDate
3-7 June 2012
Firstpage
21
Lastpage
24
Abstract
In this paper we propose novel designs that enhance the plasma concentration across the Field Stop IGBT. The “p-ring” and the “point-injection” type devices exhibit increased cathode side conductivity modulation which results in impressive IGBT performance improvement. These designs are shown to be extremely effective in lowering the on-state losses without compromising the switching performance or the breakdown rating. For the same switching losses we can achieve more than 20% reduction of the on state energy losses compared to the conventional FS IGBT.
Keywords
insulated gate bipolar transistors; losses; power semiconductor switches; cathode side conductivity modulation; field stop IGBT; p-ring type device; plasma concentration; point injection; point-injection type device; switching loss; trench insulated gate bipolar transistor; Anodes; Cathodes; Insulated gate bipolar transistors; Logic gates; Performance evaluation; Plasmas; Power semiconductor devices; Field Stop; Insulated Gate Bipolar Transistor; Point Injection; Soft Punch Through;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location
Bruges
ISSN
1943-653X
Print_ISBN
978-1-4577-1594-5
Electronic_ISBN
1943-653X
Type
conf
DOI
10.1109/ISPSD.2012.6229013
Filename
6229013
Link To Document