DocumentCode :
2472936
Title :
Prediction of resist non-uniformity caused by underlying pattern density and topology
Author :
Kim, Jin-Young ; Son, Dong-Su ; Seo, Eun-Jung ; Soh, Young-Soo ; Bak, Heung-Jin ; Oh, Hye-Keun
Author_Institution :
Hanyang Univ., Ansan, South Korea
fYear :
2000
fDate :
11-13 July 2000
Firstpage :
98
Lastpage :
99
Abstract :
We developed a simulator that can predict spin coated resist thickness with different feature type, density and topology by using dimensionless parameter and liquid resist film thickness. The change of critical dimension with surrounding topology and pattern density is simulated for the non-uniform resist thickness.
Keywords :
photoresists; semiconductor process modelling; spin coating; critical dimension; dimensionless parameter; liquid film; lithography process simulation; pattern density; resist thickness nonuniformity; spin coating; substrate topology; Coatings; Lithography; Navier-Stokes equations; Planarization; Resists; Semiconductor device modeling; Thickness control; Topology; Transistors; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2000 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-004-6
Type :
conf
DOI :
10.1109/IMNC.2000.872641
Filename :
872641
Link To Document :
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