DocumentCode :
2472977
Title :
THz semiconductor-based front-end receiver technology for space applications
Author :
Mehdi, Imran ; Siegel, Peter
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
2004
fDate :
19-22 Sept. 2004
Firstpage :
127
Lastpage :
130
Abstract :
Advances in the design and fabrication of very low capacitance planar Schottky diodes and millimeterwave power amplifiers, more accurate device and circuit models for commercial 3D electromagnetic simulators, and the availability of both MEMS and high precision metal machining, have enabled RF engineers to extend traditional waveguide-based sensor and source technologies well into the THz frequency regime. This short paper highlights recent progress in realizing THz space-qualified receiver front-ends based on room temperature semiconductor devices.
Keywords :
Schottky diodes; micromechanical devices; millimetre wave power amplifiers; space vehicle electronics; submillimetre wave detectors; submillimetre wave generation; submillimetre wave receivers; 300 to 3000 GHz; 3D electromagnetic simulators; MEMS; THz room temperature semiconductor devices; high precision metal machining; millimeterwave power amplifiers; semiconductor-based front-end receiver technology; space-qualified receiver front-ends; very low capacitance planar Schottky diodes; waveguide-based sensors; waveguide-based sources; Capacitance; Electromagnetic modeling; Electromagnetic waveguides; High power amplifiers; Millimeter wave technology; Optical device fabrication; Radiofrequency amplifiers; Schottky diodes; Space technology; VHF circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio and Wireless Conference, 2004 IEEE
Print_ISBN :
0-7803-8451-2
Type :
conf
DOI :
10.1109/RAWCON.2004.1389089
Filename :
1389089
Link To Document :
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