DocumentCode :
2473338
Title :
Fine pattern fabrication below 100 nm with 70 kV cell projection electron beam
Author :
Yamamoto, J. ; Murai, F. ; Someda, Y. ; Uchino, S.
Author_Institution :
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
fYear :
2000
fDate :
11-13 July 2000
Firstpage :
142
Lastpage :
143
Abstract :
A cell projection electron beam (EB) lithography technique has been investigated to achieve high throughput and its system has come onto the market. However cell projection method flow huge beam current, and then Coulomb interaction by electrical repulsion grow larger. The Coulomb effect causes a blur and results in degradation of resolution. This means large area electron beam exposure does not always increase throughput for fine patterns. This paper describes the effects of the acceleration voltage on resolution and throughput of fine patterns below 100 nm by experiments and simulations.
Keywords :
electron beam lithography; 100 nm; 70 kV; Coulomb interaction; acceleration voltage; cell projection electron beam lithography; fine pattern fabrication; resolution; throughput; Acceleration; Current density; Electron beams; Fabrication; Lithography; Particle beams; Resists; Space charge; Throughput; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2000 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-004-6
Type :
conf
DOI :
10.1109/IMNC.2000.872664
Filename :
872664
Link To Document :
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