Status of optoelectronic module packaging for avionics/aerospace applications

Author

Beranek, Mark W. ; Chan, Eric Y. ; Hager, Harold E. ; Le, Quynhgiao N.

Author_Institution

Boeing Co., Seattle, WA, USA

Volume

2

fYear

1998

fDate

3-4 Dec 1998

Firstpage

329

Abstract

First generation packaging technology based on hermetic MCM-C technology is well established for LED based fiber-optic links onboard commercial jet, military jet, military helicopter, and space platforms. However, the lack of packaging commonality between the various first generation platforms has resulted in high cost optoelectronic modules. Next generation requirements will challenge packaging engineers to meet higher performance requirements, including high density array based modules, at a price and productization schedule that meets program requirements

Keywords

aerospace instrumentation; avionics; integrated circuit packaging; integrated optoelectronics; modules; multichip modules; LED based fiber-optic links; aerospace applications; avionics applications; commercial jet; first generation packaging technology; hermetic MCM-C technology; high cost optoelectronic modules; high density array based modules; military helicopter; military jet; optoelectronic module packaging; packaging engineers; program requirement; space platforms; Aerospace electronics; Aerospace industry; Light emitting diodes; NASA; Nonhomogeneous media; Optical fiber cables; Optical fiber communication; Optical fibers; Packaging; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE

Conference_Location

Orlando, FL

Print_ISBN

0-7803-4947-4

Type

conf

DOI

10.1109/LEOS.1998.739633

Filename

739633