Title :
Novel CMOS low-loss transmission line structure
Author :
Kim, Jaewon ; Jung, Byunghoo ; Cheung, Philip ; Harjani, Ramesh
Author_Institution :
Minnesota Univ., Minneapolis, MN, USA
Abstract :
As operating speeds increase low-loss interconnect structures such as transmission lines become critical in the design of RF and high speed digital circuits. This paper presents a novel low-loss transmission line structure. We discuss the importance of transmission line structures, including coplanar and grounded coplanar structures. Grounded coplanar waveguide (GCPW) structures are enhanced to reduce the substrate loss. The primary goal of new interconnect topology, stacked GCPW (S-GCPW), is to reduce the loss by shaping the electric fields under the signal line. 3D electromagnetic wave simulations are used to verify the efficacy of the new transmission line structures. The insertion loss for a 4 mm long S-GCPW structure is 1.62 dB@50 GHz (0.41dB/mm) while the insertion loss for a 4 mm long traditional GCPW structure is 3.28 dB (0.82 dB/mm) in a 0.12 μm SOI CMOS technology.
Keywords :
CMOS digital integrated circuits; coplanar transmission lines; coplanar waveguides; millimetre wave integrated circuits; silicon-on-insulator; 0.12 micron; 1.62 dB; 3D electromagnetic wave simulations; 4 mm; 50 GHz; CMOS technology; RF digital circuits; S-GCPW; SOI; grounded coplanar waveguide; high speed digital circuits; low-loss interconnect structures; low-loss transmission line structure; stacked GCPW; substrate loss reduction; CMOS technology; Coplanar transmission lines; Coplanar waveguides; Digital circuits; Distributed parameter circuits; Electromagnetic waveguides; Insertion loss; Integrated circuit interconnections; Radio frequency; Transmission lines;
Conference_Titel :
Radio and Wireless Conference, 2004 IEEE
Print_ISBN :
0-7803-8451-2
DOI :
10.1109/RAWCON.2004.1389117