Title :
Design of shorting vias in alternative PCB planes for suppressing ground-bounce induced electromagnetic emission
Author :
Wu, Kai-Bin ; Chang, Fu-Sheng ; Wu, Ruey-Beei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
The stacked ground planes with vias stitching is employed to suppress the ground-bounce induced electromagnetic emission in multilayer printed circuit boards. This paper developed an analytic normal-mode analysis and used it to design the optimized positions of the vias in the board periphery. Comparison with full-wave simulation validates that the proposed systematic design procedure can easily achieve the desired EMI suppression from DC up to several GHz.
Keywords :
electromagnetic interference; printed circuit design; PCB planes; analytic normal-mode analysis; electromagnetic emission; full-wave simulation; multilayer printed circuit board; shorting vias design; stacked ground-bounce induced EMI; systematic design procedure; vias stitching; Capacitors; Design engineering; Design optimization; Electromagnetic interference; Electromagnetic radiation; IEC standards; Magnetic separation; Nonhomogeneous media; Printed circuits; Semiconductor device noise;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338430
