Title :
On adding metalization to improve via performance on PCBs
Author :
Ruehli, Albert E. ; Gu, Xiaoxiong ; Ritter, Mark B.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The design of printed circuit boards evolves continuously in density, price and performance. In this short paper, we propose an approach where the performance of a via is altered by adding additional metalizations to enhance the ground return path for signals.
Keywords :
metallisation; printed circuit design; printed circuits; ground return path; metalization; printed circuit boards; Capacitance; Coaxial components; Dielectrics; Frequency dependence; Geometry; Impedance; Insertion loss; Printed circuits; Process design; Reflection;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338440
