Design and testing of a high speed module based memory system

Author

Kollipara, Ravi ; Li, Ming ; Mullen, Don ; Beyene, Wendemagegnehu ; Madden, Chris ; Yuan, Chuck ; Kusamitsu, Hideki ; Ito, Toshiyasu

Author_Institution

Rambus, Inc., Los Altos, CA, USA

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

191

Lastpage

194

Abstract

An LCP flex based interconnect and a mating area array connector are used to increase the bandwidth of the module based memory systems. Simulations show that data rates in the range of 6.4 Gbps to 16.0 Gbps are possible depending on the memory system configuration. Tested prototype memory systems confirmed simulation predicted data rates of 16 Gbps and 12.8 Gbps for flex interconnect lengths of 6" and 12", respectively.

Keywords

electric connectors; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; integrated circuit testing; integrated memory circuits; modules; LCP flex based interconnect; high speed module based memory system design; mating area array connector; prototype memory system testing; Assembly systems; Connectors; Crosstalk; Dielectric losses; Dielectric materials; Packaging; Random access memory; Reflection; Sockets; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338444

Filename

5338444