DocumentCode :
2474090
Title :
Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions
Author :
Hsiao, Yu-Chung ; El-Moselhy, Tarek ; Daniel, Luca
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2009
fDate :
19-21 Oct. 2009
Firstpage :
179
Lastpage :
182
Abstract :
In this paper we show how the highly restrictive design rules of the recent sub-micro to nano-scale integrated circuit technologies allow to use a limited number of pre-computed surface charge distributions as a set of fundamental template basis functions in an efficient integral equation based 3D capacitance solver. Several examples verify that our solver can achieve final accuracies of less than 2% using 5times to 30times fewer unknowns than standard piecewise constant basis functions for the same accuracy, resulting in up to 25times speedups.
Keywords :
capacitance measurement; integrated circuit design; integrated circuit interconnections; surface charging; 3D interconnect; efficient capacitance solver; fundamental template basis functions; integral equation based 3D capacitance solver; nanoscale integrated circuit technology; precomputed surface charge distributions; submicro integrated circuit technology; template-instantiated basis functions; Capacitance; Conductors; Electrostatics; Integral equations; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Table lookup; Testing; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
Type :
conf
DOI :
10.1109/EPEPS.2009.5338449
Filename :
5338449
Link To Document :
بازگشت