• DocumentCode
    2474090
  • Title

    Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions

  • Author

    Hsiao, Yu-Chung ; El-Moselhy, Tarek ; Daniel, Luca

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2009
  • fDate
    19-21 Oct. 2009
  • Firstpage
    179
  • Lastpage
    182
  • Abstract
    In this paper we show how the highly restrictive design rules of the recent sub-micro to nano-scale integrated circuit technologies allow to use a limited number of pre-computed surface charge distributions as a set of fundamental template basis functions in an efficient integral equation based 3D capacitance solver. Several examples verify that our solver can achieve final accuracies of less than 2% using 5times to 30times fewer unknowns than standard piecewise constant basis functions for the same accuracy, resulting in up to 25times speedups.
  • Keywords
    capacitance measurement; integrated circuit design; integrated circuit interconnections; surface charging; 3D interconnect; efficient capacitance solver; fundamental template basis functions; integral equation based 3D capacitance solver; nanoscale integrated circuit technology; precomputed surface charge distributions; submicro integrated circuit technology; template-instantiated basis functions; Capacitance; Conductors; Electrostatics; Integral equations; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Table lookup; Testing; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-1-4244-4447-2
  • Electronic_ISBN
    978-1-4244-5646-8
  • Type

    conf

  • DOI
    10.1109/EPEPS.2009.5338449
  • Filename
    5338449