DocumentCode
2474221
Title
The investigation of the formaldehyde gas sensor based on organic thin-film-transistors
Author
Yan, Jian-fei ; Wu, Zhi-ming ; Tai, Hui-Ling ; Xian Li ; Yao Wang ; Su, Yuan-jie ; Ping, Cong
Author_Institution
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
fYear
2010
fDate
17-19 Dec. 2010
Firstpage
213
Lastpage
216
Abstract
The organic thin film transistor (OTFT) with the ratio of channel width (W) to length (L) as 8000/25 was fabricated for the application of formaldehyde gas sensors. The copper phthalocyanine (CuPc) and silicon dioxide was used as the active layer and the insulating layer, respectively, and the titanium/aurum thin films were made as the source/drain electrodes for the prepared OTFT. The voltage-current characteristic curve of the OTFT was measured. The source-drain current in the saturation region changed when the prepared OTFT device was exposed to formaldehyde vapour compared to that under the circumstance of nitrogen at room temperature. It was observed that the OTFT sensor based on CuPc has high sensitivity for formaldehyde vapour. The source-drain current can be considered as a key parameter to monitor chemical species. Such OTFT devices are promising to operate as a novel chemical sensors.
Keywords
copper compounds; electrodes; gas sensors; metallic thin films; organic compounds; thin film transistors; titanium; CuPc; OTFT; SiO2; channel length; channel width; chemical sensor; copper phthalocyanine; formaldehyde gas sensor; formaldehyde vapour; organic thin-film-transistor; source-drain electrode current; temperature 293 K to 298 K; titanium-aurum thin films; voltage-current characteristic curve; Copper; Electrodes; Gas detectors; Nitrogen; Organic thin film transistors; Sensitivity; CuPc; Organic thin film transistors (OTFT); formaldehyde gas sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Apperceiving Computing and Intelligence Analysis (ICACIA), 2010 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-8025-8
Type
conf
DOI
10.1109/ICACIA.2010.5709885
Filename
5709885
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