Model-to-hardware correlation of disk resonators for via-array modeling in high-speed PCBs

Author

Chada, Arun Reddy ; Kwark, Young H. ; Gu, Xiaoxiong ; Fan, Jun

Author_Institution

Missouri S&T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

155

Lastpage

158

Abstract

In high-speed printed circuit board (PCB) designs, vias play a critical role in determining signal and power integrity. This paper uses disk resonators to investigate modeling approaches for common via array structures. Boundary integral equation (BIE) and effective dielectric medium approaches are used for a perforated disk resonator with non-plated holes, using dielectric properties derived from a solid disk resonator study. Both approaches are compared and validated with measurements.

Keywords

dielectric resonators; high-speed integrated circuits; integral equations; integrated circuit modelling; printed circuits; boundary integral equation; dielectric properties; effective dielectric medium; high-speed PCB; model-to-hardware correlation; nonplated holes; perforated disk resonators; power integrity; printed circuit board; signal integrity; via-array modeling; Dielectric measurements; Electromagnetic compatibility; Frequency; Impedance; Integral equations; Laboratories; Printed circuits; Scattering parameters; Signal design; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338455

Filename

5338455