DocumentCode :
2474277
Title :
An unconditionally stable time-domain finite element method of significantly reduced computational complexity for large-scale simulation of IC and package problems
Author :
Gan, Houle ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
2009
fDate :
19-21 Oct. 2009
Firstpage :
145
Lastpage :
148
Abstract :
An unconditionally stable and computationally efficient time-domain finite-element method is developed to solve large-scale IC and package problems. In this method, an analytical expression of the time dependence is developed for the field unknowns inside conductors. And hence any time step can be used to stably solve the system of equations inside conductors. A matrix solution is involved in the analytical expression. It is efficiently obtained by the time-domain finite-element reduction-recovery method, the factorization cost of which is O(M), with M much less than the system matrix size N. The system of equations exterior to conductors is formed by a backward difference method, and hence is also unconditionally stable. The resultant system matrix is solved efficiently by an H-matrix based direct sparse solver, which is shown to outperform the state-of-the-art direct sparse solver. The system exterior to the conductors and that interior to the conductors are then solved by a staggered marching scheme, the convergence of which is theoretically proved. Applications to on-chip problems have demonstrated a time step that is three orders of magnitude larger than what is permitted by an explicit time-domain scheme, with fast CPU run time, modest memory consumption, and without sacrificing accuracy.
Keywords :
conductors (electric); electronics packaging; finite element analysis; integrated circuit modelling; integrated circuits; large scale integration; time-domain analysis; H-matrix based direct sparse solver; analytical expression; computational complexity; conductors; factorization cost; large-scale IC; large-scale simulation; matrix solution; on-chip problems; package problems; stable time-domain finite element method; Computational complexity; Computational modeling; Conductors; Equations; Finite element methods; Integrated circuit modeling; Integrated circuit packaging; Large-scale systems; Sparse matrices; Time domain analysis; Unconditionally stable schemes; electromagnetic simulation; fast solvers; on-chip; package; time domain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
Type :
conf
DOI :
10.1109/EPEPS.2009.5338457
Filename :
5338457
Link To Document :
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