DocumentCode
2474321
Title
Bonding wire current measurement with tiny film current sensors
Author
Hirai, Hidetoshi ; Kasho, Yuya ; Tsukuda, Masanori ; Omura, Ichiro
Author_Institution
Kyushu Inst. of Technol., Kitakyushu, Japan
fYear
2012
fDate
3-7 June 2012
Firstpage
287
Lastpage
290
Abstract
Bonding wire current measurement technique has been highly desired to analyze failure phenomena, such as short circuit and avalanche destruction of IGBT and power diode. This paper challenged to measure bonding wire current distribution in an IGBT module with the multiple tiny film current sensors and the digital calculation technique. The authors successfully measured bonding wire current under a single shot measurement.
Keywords
diodes; electric current measurement; failure analysis; insulated gate bipolar transistors; lead bonding; IGBT; avalanche destruction; bonding wire current measurement; failure phenomena; power diode; short circuit; tiny film current sensors; Bonding; Coils; Current measurement; Films; Magnetic sensors; Wires; bonding wire current mesurement; digital calculation technique; film current sensor with tiny-scale coils; high speed analog amplifiers;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location
Bruges
ISSN
1943-653X
Print_ISBN
978-1-4577-1594-5
Electronic_ISBN
1943-653X
Type
conf
DOI
10.1109/ISPSD.2012.6229079
Filename
6229079
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