Hybrid substrate integrated waveguides developed using flexible substrates

Author

Mahani, Mohammad S. ; Suntives, Asanee ; Abhari, Ramesh

Author_Institution

Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, QC, Canada

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

125

Lastpage

128

Abstract

In this paper, hybrid substrate integrated waveguide (SIW) structures developed using multi-layer flexible laminates are investigated for application in off-the-board chip-to-chip communication systems. It is shown through full-wave simulations that the transmission characteristics of the TEM and TE₁₀ channels of the hybrid SIW are virtually unaffected by the substrate bending. This new implementation platform is found to be suitable for high-speed applications due to its relatively low dielectric losses and offers new possibilities for deployment of the hybrid SIW interconnect.

Keywords

dielectric losses; integrated circuit interconnections; laminates; multilayers; printed circuits; substrate integrated waveguides; TE₁₀ channels; dielectric losses; flexible substrates; full wave simulation; high-speed applications; hybrid SIW interconnect; hybrid substrate integrated waveguides; multilayer flexible laminates; off-the-board chip-to-chip communication systems; substrate bending; Application software; Dielectric losses; Dielectric substrates; Electromagnetic waveguides; Fabrication; High-speed electronics; Integrated circuit interconnections; Laminates; Routing; Stripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338460

Filename

5338460