DocumentCode
2474466
Title
Extraction of equivalent inductance in package-PCB hierarchical power distribution network
Author
Kim, Jingook ; Kim, Jaemin ; Ren, Liehui ; Fan, Jun ; Kim, Joungho ; Drewniak, James L.
Author_Institution
EMC Lab., Missouri Univ. of Sci. & Technol. (formerly Univ. of Missouri-Rolla), Rolla, MO, USA
fYear
2009
fDate
19-21 Oct. 2009
Firstpage
109
Lastpage
112
Abstract
A method to calculate equivalent inductances of multiple vias in arrays has been proposed. The method has been applied to the modeling of a hierarchical power bus and validated by measurements. It is accurate at the frequencies lower than the cavity resonant frequencies.
Keywords
inductance; printed circuits; cavity resonant frequencies; equivalent inductances; multiple vias; package-PCB hierarchical power distribution network; Capacitors; Cavity resonators; Impedance; Inductance; Packaging; Power system modeling; Power systems; Resonance; Resonant frequency; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location
Portland, OR
Print_ISBN
978-1-4244-4447-2
Electronic_ISBN
978-1-4244-5646-8
Type
conf
DOI
10.1109/EPEPS.2009.5338464
Filename
5338464
Link To Document