Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

Author

Xie, Jianyong ; Chung, Daehyun ; Swaminathan, Madhavan ; Mcallister, Michael ; Deutsch, Alina ; Jiang, Lijun ; Rubin, Barry J.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

113

Lastpage

116

Abstract

In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system.

Keywords

circuit simulation; thermal conductivity; thermal management (packaging); voltage distribution; 3D system integration; electrical characteristics; hot spot temperature; parameterized electrical-thermal co-analysis; power delivery networks; system components; thermal characteristics; thermal interface material; through-silicon vias; underfill material; voltage source location affect; Conducting materials; Control systems; Electric variables control; Position measurement; Stacking; Temperature; Thermal conductivity; Thermal variables control; Through-silicon vias; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338465

Filename

5338465