• DocumentCode
    2474505
  • Title

    Treeing of ethylene-propylene rubber in cryogenic temperature region

  • Author

    Kosaki, Masamitsu ; Minoda, Atsusli ; Mitsuyama, Yasuiclu ; Mizuno, Yukio ; Nagao, Masayuki

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Toyohashi Univ. of Technol., Japan
  • fYear
    1993
  • fDate
    17-20 Oct 1993
  • Firstpage
    701
  • Lastpage
    706
  • Abstract
    The authors report results on the treeing resistivity of EPR (ethylene-propylene rubber) at both liquid nitrogen temperature and room temperature, and the effect of fillers on treeing. A treeing test method was established for opaque sample based on the detection of partial discharges. At room temperature, fillers lower the tree initiation voltage slightly but the growth of tree channels is inhibited by fillers. The tree initiation voltage at liquid nitrogen temperature is about three times higher than that at room temperature. Fillers improve treeing resistivity slightly. EPR has sufficient resistance to treeing at liquid nitrogen temperature. High reliability is expected during the long term operation of extruded EPR-insulated superconducting power cables considered by the authors
  • Keywords
    ethylene-propylene rubber; filled polymers; partial discharges; power cable insulation; superconducting cables; trees (electrical); 300 K; 77 K; EPR; cryogenic temperature region; ethylene-propylene rubber; extruded EPR-insulated superconducting power cables; fillers; long term operation; opaque sample; partial discharges; reliability; room temperature; tree initiation voltage; treeing; treeing resistivity; treeing test method; Conductivity; Cryogenics; Nitrogen; Paramagnetic resonance; Partial discharges; Rubber; Superconducting cables; Temperature; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1993. Annual Report., Conference on
  • Conference_Location
    Pocono Manor, PA
  • Print_ISBN
    0-7803-0966-9
  • Type

    conf

  • DOI
    10.1109/CEIDP.1993.378891
  • Filename
    378891