Title :
Opto-electronic packaging for broadband high speed (40 Gb/s) optical demultiplexer chip
Author :
Rosin, Th. ; Bornholdt, C. ; Hoffmann, D. ; Burghardt, R.
Author_Institution :
Heinrich-Hertz-Inst. fur Nachrichtentech. Berlin GmbH, Germany
Abstract :
Summary form only given. We described a simple, quick, robust, and reusable opto-electronic packaging method for devices with narrow-spaced fibers for use in laboratory test beds and field tests
Keywords :
chip scale packaging; demultiplexing equipment; high-speed optical techniques; integrated optoelectronics; optical communication equipment; broadband high speed optical demultiplexer chip; field tests; laboratory test beds; narrow-spaced fibers; opto-electronic packaging; reusable opto-electronic packaging method; High speed optical techniques; Laboratories; Optical coupling; Optical fiber devices; Optical fiber polarization; Optical fiber testing; Optical waveguides; Packaging; Stimulated emission; System testing;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4947-4
DOI :
10.1109/LEOS.1998.739757
