Thermally induced shifts in an optical fiber soldered into a ferrule

Author

Chang, H.L. ; Wang, S.C. ; Wang, C. ; Wang, C.M. ; Liaw, J.W. ; Sheen, M.T. ; Sheu, Y.C. ; Kuang, J.H. ; Chen, C.H. ; Chien, C.P. ; Cheng, W.H.

Author_Institution

Chunghwa Telecom Lab., Taoyuan, Taiwan

Volume

2

fYear

1998

fDate

3-4 Dec 1998

Firstpage

388

Abstract

The thermally induced fiber shifts under a temperature cycling test of an optical fiber soldered into a ferrule packaging was measured experimentally. Up to a 0.18 μm of the fiber shift was found in temperature cycling from -40 to +85°C. This fiber displacement may arise from both the relief of the residual stresses and the intermetallic compound growth within the solder during the temperature cycling test. A finite-element method (FEM) analysis was also performed on the calculation of the up-bound fiber shift. Results showed that up to a 0.27 μm of the fiber shift was predicted. This indicates that the FEM is an effective method for predicting the up-bound fiber shifts in temperature cycling test for laser module reliability study

Keywords

internal stresses; modules; optical communication equipment; optical testing; packaging; reliability; semiconductor lasers; thermal stresses; -40 to 85 C; FEM; ferrule; finite-element method; intermetallic compound growth; laser module reliability study; optical fiber soldering; residual stresses; temperature cycling; temperature cycling test; thermally induced fiber shifts; thermally induced shifts; up-bound fiber shift; Assembly; Displacement measurement; Fiber lasers; Finite element methods; Optical fiber testing; Optical fibers; Packaging; Residual stresses; State feedback; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE

Conference_Location

Orlando, FL

Print_ISBN

0-7803-4947-4

Type

conf

DOI

10.1109/LEOS.1998.739759

Filename

739759