DocumentCode
2474637
Title
11E-3 A Thermally Stable CMOS Oscillator Using Temperature Compensated FBAR
Author
Pang, Wei ; Ruby, Rich C. ; Parker, Reed ; Fisher, Philip W. ; Larson, John D., III ; Grannen, Kevin J. ; Lee, Donald ; Feng, Chris ; Callaghan, Lori
Author_Institution
Avago Technol., San Jose
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
1041
Lastpage
1044
Abstract
This paper presents a passively temperature compensated CMOS oscillator utilizing Film Bulk Acoustic Resonator (FBAR). The resonator exhibiting f-Q product of 2~3times1012 sec-1 is comprised of molybdenum (Mo), aluminum nitride (AlN), and a compensation material that has positive temperature coefficient of Young´s modulus. The 600 MHz oscillator consumes 6.6 mW from a 3.3 V supply and achieves an excellent phase noise performance of -102 dBc/Hz, -132 dBc/Hz, and -151 dBc/Hz at 1 kHz, 10 kHz, and 100 kHz carrier offset, respectively. The oscillator´s temperature-dependent frequency drift is less than 80 parts per million (ppm) over a temperature range of -35 to +85degC.
Keywords
Young´s modulus; acoustic resonators; aluminium compounds; molybdenum; phase noise; ultrasonics; CMOS oscillator; Young modulus; aluminum nitride; film bulk acoustic resonator; frequency 600 MHz; molybdenum; Clocks; Consumer electronics; Film bulk acoustic resonators; Frequency; Micromechanical devices; Oscillators; Phase noise; Stability; Temperature distribution; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1384-3
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.263
Filename
4409836
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