• DocumentCode
    2474751
  • Title

    Great impact of RFC technology on fast recovery diode towards 600 V for low loss and high dynamic ruggedness

  • Author

    Masuoka, Fumihito ; Nakamura, Katsumi ; Nishii, Akito ; Terashima, Tomohide

  • Author_Institution
    Power Device Works, Mitsubishi Electr. Corp., Fukuoka, Japan
  • fYear
    2012
  • fDate
    3-7 June 2012
  • Firstpage
    373
  • Lastpage
    376
  • Abstract
    In the fast recovery operation of Free-wheeling Diode (FWD), to reduce voltage surge “snap-off”, we propose the Relaxed Field of Cathode (RFC)-planar anode diode in the range of 600 V to 1700 V. RFC effect is described by the parallel connection of pin diode and pnp transistor in as a single chip solution. Its structure is realized by our thin wafer process technology utilizing the backside lithography to make p/n alternating pattern after thining the wafer. As the result, our RFC diode up to 1700 V has the following three advantages comparing with the conventional one: (a) 40% lower recovery loss (EREC), 30% lower forward voltage drop (VF), (b) a large recovery Safe Operating Area (SOA) with the high peak power density of 1.4W/cm2 and (c) easiness to adjust a lower crosspoint below rated current density in the output I-V. Therefore, the proposed RFC diode has a great potential as the next generation Si FWD in the all voltage range.
  • Keywords
    p-i-n diodes; RFC diode; RFC effect; RFC technology; backside lithography; fast recovery diode; fast recovery operation; forward voltage drop; free-wheeling diode; high dynamic ruggedness; large recovery safe operating area; parallel connection; peak power density; pin diode; planar anode diode; pnp transistor; relaxed field of cathode; single chip solution; voltage 600 V to 1700 V; voltage surge snap-off; wafer process technology; Anodes; Cathodes; Electric fields; Oscillators; P-i-n diodes; Plasmas; Semiconductor optical amplifiers; FWD; RFC; SOA; dynamic ruggedness; fast recovery; oscillation; snap-off; turn-off capability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
  • Conference_Location
    Bruges
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4577-1594-5
  • Electronic_ISBN
    1943-653X
  • Type

    conf

  • DOI
    10.1109/ISPSD.2012.6229099
  • Filename
    6229099