DocumentCode :
2474914
Title :
Statistical analysis of multistress aging studies of polyetherimide
Author :
Suthar, J.L. ; Stokes, A.N. ; Khachen, W. ; Laghari, J.R. ; Hammoud, A.N.
Author_Institution :
Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
fYear :
1993
fDate :
17-20 Oct 1993
Firstpage :
568
Lastpage :
573
Abstract :
Multistress accelerated aging experiments on polyetherimide (PEI) film were conducted by applying a combination of accelerated thermal and electrical (400 Hz) stresses in a full factorial experiment. Weibull and lognormal distributions are used along with general goodness-of-fit measures, the Shapiro-Wilk, W test, and the Shapiro-Brain, W´test, to assess the statistical distribution of the lifetimes for all stress combinations. To detect significant interaction between the individual stresses and quantify the effect of each stress on the life of the film, an analysis of variance is conducted. The obtained mean life data are then fitted to various existing empirical multistress aging models to suggest the most statistically significant among the tested models. It is shown that either the Weibull or the lognormal distribution can estimate statistical mean within a range of acceptable linearity. The goodness of fit measures, W test and W´ test, also consistently support the hypothesis and provide no evidence of rejecting either as an adequate statistical distribution
Keywords :
ageing; insulation testing; insulator testing; life testing; polymer films; polymer insulators; statistical analysis; thermal stresses; 400 Hz; Shapiro-Brain; Shapiro-Wilk; W test; W´test; Weibull distributions; electrical stresses; full factorial experiment; goodness-of-fit measures; lifetimes; lognormal distributions; mean life data; multistress aging; polyetherimide; statistical distribution; thermal stresses; Accelerated aging; Analysis of variance; Conductive films; Life testing; Statistical analysis; Statistical distributions; Stress measurement; Thermal conductivity; Thermal factors; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1993. Annual Report., Conference on
Conference_Location :
Pocono Manor, PA
Print_ISBN :
0-7803-0966-9
Type :
conf
DOI :
10.1109/CEIDP.1993.378912
Filename :
378912
Link To Document :
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