• DocumentCode
    2474914
  • Title

    Statistical analysis of multistress aging studies of polyetherimide

  • Author

    Suthar, J.L. ; Stokes, A.N. ; Khachen, W. ; Laghari, J.R. ; Hammoud, A.N.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
  • fYear
    1993
  • fDate
    17-20 Oct 1993
  • Firstpage
    568
  • Lastpage
    573
  • Abstract
    Multistress accelerated aging experiments on polyetherimide (PEI) film were conducted by applying a combination of accelerated thermal and electrical (400 Hz) stresses in a full factorial experiment. Weibull and lognormal distributions are used along with general goodness-of-fit measures, the Shapiro-Wilk, W test, and the Shapiro-Brain, W´test, to assess the statistical distribution of the lifetimes for all stress combinations. To detect significant interaction between the individual stresses and quantify the effect of each stress on the life of the film, an analysis of variance is conducted. The obtained mean life data are then fitted to various existing empirical multistress aging models to suggest the most statistically significant among the tested models. It is shown that either the Weibull or the lognormal distribution can estimate statistical mean within a range of acceptable linearity. The goodness of fit measures, W test and W´ test, also consistently support the hypothesis and provide no evidence of rejecting either as an adequate statistical distribution
  • Keywords
    ageing; insulation testing; insulator testing; life testing; polymer films; polymer insulators; statistical analysis; thermal stresses; 400 Hz; Shapiro-Brain; Shapiro-Wilk; W test; W´test; Weibull distributions; electrical stresses; full factorial experiment; goodness-of-fit measures; lifetimes; lognormal distributions; mean life data; multistress aging; polyetherimide; statistical distribution; thermal stresses; Accelerated aging; Analysis of variance; Conductive films; Life testing; Statistical analysis; Statistical distributions; Stress measurement; Thermal conductivity; Thermal factors; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1993. Annual Report., Conference on
  • Conference_Location
    Pocono Manor, PA
  • Print_ISBN
    0-7803-0966-9
  • Type

    conf

  • DOI
    10.1109/CEIDP.1993.378912
  • Filename
    378912