DocumentCode :
2474998
Title :
Power mos current sensefet temperature drift study and improvement by the help of 3D simulations
Author :
Germana, R.
Author_Institution :
Body & Audio Div., STMicroelectron., Peynier, France
fYear :
2012
fDate :
3-7 June 2012
Firstpage :
413
Lastpage :
416
Abstract :
A sensefet monitoring is used for overload, open-load detection and load current analog feedback. The sensefet matching properties to the main power mos represent the main quality factor of the device. Its current should be proportional to the main power one, maintaining the same coefficient over the entire temperature and biasing working range. In this work the effects of the edge cells layout and process are analyzed by the help of 3D device simulations. The causes for the real to theoretical ratio mismatch and the drift behavior versus the temperature are put into evidence. The corrective actions allow to reach 1÷2% of drift in the range -40°C to 150°C. Only technological considerations are here faced, concerning the construction and optimization of the structure.
Keywords :
electric sensing devices; feedback; power MOSFET; semiconductor device models; 3D device simulation; 3D simulations; edge cells layout; load current analog feedback; open-load detection; overload detection; power MOS current sensefet; sensefet matching; sensefet monitoring; structure construction; structure optimization; temperature -40 C to 150 C; temperature drift study; Doping; Immune system; Layout; Logic gates; Resistance; Temperature; Temperature sensors; Current sensing; Power mos; VDMOS; sense ratio; temperature drift;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location :
Bruges
ISSN :
1943-653X
Print_ISBN :
978-1-4577-1594-5
Electronic_ISBN :
1943-653X
Type :
conf
DOI :
10.1109/ISPSD.2012.6229109
Filename :
6229109
Link To Document :
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