• DocumentCode
    2475156
  • Title

    Embedded tutorial: Fundamentals of macromodeling for signal integrity analysis

  • Author

    Triverio, Piero ; Nakhla, Michel

  • fYear
    2009
  • fDate
    19-21 Oct. 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Computer aided design tools are an integral part of the design flow of modern electronic systems. However, lack of physical consistency of the models that are used in the simulation and optimization cycle can cause the design tools to slow down unpredictably or even fail. This tutorial provides a comprehensive analysis of this important topic, with emphasis on relevant properties of the macromodel and associated data such as causality, stability and passivity and their interdependency. These properties are crucial for the transient simulation of high-speed modules. Several design scenarios will be examined to show the effects of consistency violations on real design tasks, while outlining suitable best-practice rules to avoid them. Finally, an overview of the best numerical techniques for checking and enforcing physical consistency during measurement, modeling and simulation tasks will be presented.
  • Keywords
    electronic design automation; integrated circuit design; integrated circuit measurement; integrated circuit modelling; computer aided design tools; embedded tutorial; macromodeling; signal integrity analysis; Computational modeling; Design automation; Design optimization; Electromagnetic compatibility; Electromagnetic measurements; Embedded computing; Signal analysis; Signal design; Stability analysis; Tutorial;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-1-4244-4447-2
  • Electronic_ISBN
    978-1-4244-5646-8
  • Type

    conf

  • DOI
    10.1109/EPEPS.2009.5338496
  • Filename
    5338496