• DocumentCode
    2475214
  • Title

    12E-0 2X Size and Cost Reduction of Film Bulk Acoustic Resonator (FBAR) Chips with Tungsten Electrodes for PCS/GPS/800 MHz Multiplexers

  • Author

    Bradley, P. ; Kim, J. ; Ye, S. ; Nikkel, P. ; Bader, S. ; Feng, C.

  • Author_Institution
    Avago Technol., San Jose
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1144
  • Lastpage
    1147
  • Abstract
    It is well known that using tungsten electrodes can boost the effective coupling coefficient, hence bandwidth, of film bulk acoustic resonator (FBAR) filters relative to lower acoustic impedance electrode materials. This effect is strongest for FBARs with much less A1N than would be used to achieve the maximum coupling. In the case of 800 MHz (cellband) duplexers, although the performance has been excellent, the cost of FBAR solutions has been too high due to large resonator and die size (1.8 mm2), even in the PCS/GPS/800 MHz multiplexer applications. A combination of the high effective coupling coefficient of tungsten electrode FBARs, a better duplexer design, tighter design rules, and a higher quality factor (Q) have contributed to a die size reduction to about 1 mm2. Performance is competitive with the best surface acoustic wave (SAW) devices we have seen These parts, when used in a PCS/GPS/800 MHz multiplexer provide a high-performance and cost-competitive RF front end filtering solution for CDMA handsets .
  • Keywords
    acoustic impedance; acoustic resonators; acoustoelectric devices; bulk acoustic wave devices; code division multiple access; multiplexing equipment; radiofrequency filters; surface acoustic wave devices; tungsten; CDMA handsets; FBAR chips; FBAR filters; PCS/GPS/800 MHz multiplexers; RF front end filtering; W; acoustic impedance electrode materials; cellband duplexers; cost reduction; film bulk acoustic resonator; frequency 800 MHz; size reduction; surface acoustic wave devices; tungsten electrodes; Bandwidth; Costs; Electrodes; Film bulk acoustic resonators; Global Positioning System; Impedance; Multiplexing; Personal communication networks; Resonator filters; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.289
  • Filename
    4409862