Title :
12F-3 A Pitch-Catch UHF Piezoelectric Transformer Fabricated with Thin Film PZT Transducers
Author :
Larson, John D. ; Gilbert, Stephen R. ; Frank, Michael L.
Author_Institution :
Avago Technol., San Jose
Abstract :
A novel high isolation piezoelectric transformer operating in the UHF band is presented. The acoustically coupled transformer (ACT) is composed of thin film PZT transducers on both sides of an insulating substrate. The input transducer launches an acoustic wave through the insulating substrate to the output transducer in a pitch/catch mode to realize a 1:1 turns ratio. Appropriate series connection of multiple input transducers and parallel connection of the corresponding output transducers results in a transformer with an N:1 turns ratio. The ACT is fabricated using standard thin film and wafer scale fabrication techniques on a 150 mm diameter alumina wafer. The PZT transducers are deposited on Pt electrodes on both sides of the substrate by a sol-gel method. A backside photo-aligner is used to assure alignment of front and back side devices. Thousands of transformers can be made at once, thus eliminating costly one-off manufacturing. A novel differential electrode structure is used to apply the electric field to the PZT transducers without the need to etch the PZT film to reach the bottom electrode. Scattering (S) parameters of the ACT devices were obtained experimentally with a novel double-sided probe station that used air co-planar microprobes and a differential network analyzer. ACT transformers of 1:1 voltage ratio, with high DC isolation, and operating in the 20 to 200 MHz range are realized. The transformers exhibit a series of low insertion loss resonant peaks, spaced ~12 MHz apart, with |S21| as low as -1.2 dB when conjugate matched at the input and output ports. A temperature coefficient of frequency of -49 ppm/degC is measured. Power densities in excess of 400 Watts/cm3 are achieved. Dispersion diagrams for the allowed vibration modes are presented.
Keywords :
S-parameters; UHF devices; acoustic couplers; alumina; electrodes; piezoelectric thin films; piezoelectric transducers; platinum; power transformers; sol-gel processing; thin film sensors; wafer-scale integration; Al2O3; PZT; Pt; acoustically coupled transformer; air co-planar microprobes; alumina wafer; backside photo-aligner; differential electrode structure; differential network analyzer; dispersion diagrams; double-sided probe station; frequency 20 MHz to 200 MHz; insertion loss; insulating substrate; parallel connection; pitch-catch UHF piezoelectric transformer fabrication; power densities; scattering parameters; series connection; size 150 mm; sol-gel method; temperature coefficient; thin film PZT transducers; vibration modes; wafer scale fabrication techniques; Acoustic transducers; Acoustic waves; Electrodes; Fabrication; Manufacturing; Piezoelectric films; Piezoelectric transducers; Power transformer insulation; Substrates; Transistors;
Conference_Titel :
Ultrasonics Symposium, 2007. IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4244-1384-3
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2007.295