Online non-contact fault detection of LED chips

Author

Li, Lian ; Wen, Jing ; Li, Ping ; Wen, Yumei ; Yin, Fei

Author_Institution

Key Lab. for Opto-Electron. Technol. & Syst. of Minist. of Educ., Chongqing Univ., Chongqing

fYear

2008

fDate

25-27 June 2008

Firstpage

280

Lastpage

283

Abstract

An online non-contact fault detection Method of LED chips is presented based on the photovoltaic effect in diodes. By observing the photo-generated current in the bonding lead frame of a LED chip, the LED chip and its electric connection with the lead frame during packaging are checked. The fault detection principle is described in detail in this paper. By using the method based on the law of electromagnetic induction, the photo-generated current can be measured without any touch. The experimental results show that the method can be easily realized, and thus can be used for online fault detection of LED chips in packaging.

Keywords

fault diagnosis; integrated circuit packaging; light emitting diodes; LED chips; diodes; electromagnetic induction; online noncontact fault detection; photogenerated current; photovoltaic effect; Bonding; Current measurement; Electrical fault detection; Electromagnetic induction; Electromagnetic measurements; Fault detection; Light emitting diodes; Packaging; Photovoltaic effects; Semiconductor device measurement; LED; non-contact detection; online detection; packaging; photovoltaic effect;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent Control and Automation, 2008. WCICA 2008. 7th World Congress on

Conference_Location

Chongqing

Print_ISBN

978-1-4244-2113-8

Electronic_ISBN

978-1-4244-2114-5

Type

conf

DOI

10.1109/WCICA.2008.4592937

Filename

4592937