DocumentCode
2475744
Title
P0-15 Temperature Compensated Bulk Acoustic Wave Resonator and its Predictive 1D Acoustic Tool for RF Filtering
Author
Petit, D. ; Abelé, N. ; Volatier, A. ; Lefevre, A. ; Ancey, P. ; Carpentier, J.F.
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
1243
Lastpage
1246
Abstract
The design of bulk acoustic wave "BAW" resonators should take into account the stringent requirements of thermal effects. In this paper, we propose a thermal model, allowing the reduction of the Temperature Coefficient of Frequency "TCF" with a slightly modified process while retaining a good coupling and quality factor. For a significant reduction of the TCF, a SiO2 layer is added above the upper electrode. A TCF of +1.5 ppm/degC was obtained at 2.08 GHz. The present accuracy of the ID model is approximately 1 ppm/degC. Most material parameters were extracted by comparison between the modeling and the measurement of BAW resonators with different stacks. To improve the dispersion of the TCF, the uniformity of each layer is introduced into the model. Firstly, the reduction of the top SiO2 Bragg layer thickness dispersion from 2 % to 0.2 % is achieved, using an ion etching. The compensation of BAW resonators in our process has been improving for PCS diversity standard. This model was used to design a Personal Communications Service "PCS" RX diversity filter (1.93-1.99 GHz). The compensated loaded and unloaded resonators were used in the filtering function and present TCFs between 0.8 and -7 ppm/degC with a coupling factor of approximately 5.2 %.
Keywords
Q-factor; acoustic resonator filters; bulk acoustic wave devices; personal communication networks; radiofrequency filters; BAW resonator; Bragg layer thickness dispersion; PCS RX diversity filter; RF filtering; bulk acoustic wave resonator; coupling factor; frequency 1.93 GHz to 1.99 GHz; frequency 2.08 GHz; ion etching; personal communications service; predictive 1D acoustic tool; quality factor; temperature coefficient-of- frequency; temperature compensation; thermal model; Acoustic waves; Electrodes; Etching; Filtering; Personal communication networks; Q factor; Radio frequency; Resonator filters; Temperature; Thermal factors;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1383-6
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.312
Filename
4409885
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