DocumentCode :
2475946
Title :
Thermal Characteftistics of Potted Electronic Modules
Author :
Gonzales, J.I. ; Waugh, C.E.
fYear :
1962
fDate :
1962
Firstpage :
105
Lastpage :
119
Keywords :
Analytical models; Electronic packaging thermal management; Electronics packaging; Heat sinks; Heat transfer; Reliability engineering; Space heating; Temperature; Testing; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
1962 IRE National Convention
Type :
conf
DOI :
10.1109/IRENC.1962.199230
Filename :
1536170
Link To Document :
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