High-Density-Package Joining Techniques

Author

Johnson, Charles W. ; Konsowski, Steven G.

fYear

1962

fDate

1962

Firstpage

120

Lastpage

125

Keywords

Circuits; Costs; Environmental economics; Flexible manufacturing systems; Heat sinks; Lead; Packaging; Process control; Soldering; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

1962 IRE National Convention

Type

DOI

10.1109/IRENC.1962.199231

Filename

1536171

Link To Document