DocumentCode :
2476483
Title :
A new model for propagation of electrical tree structures in polymeric insulation
Author :
Ding, H.-Z. ; Varlow, B.R.
Author_Institution :
Sch. of Eng., Manchester Univ., UK
fYear :
2002
fDate :
2002
Firstpage :
934
Lastpage :
937
Abstract :
A quantitative physical model for propagation of electrical tree structures in polymeric insulation is presented. In the present model the propagation of trees arises from the formation of electrodamage that precedes and surrounds the tree tip during the tree propagation process. Electrical tree propagation is modeled as the growth of a fractal cluster, which consists of submicroscopic trees. The formation and growth of the submicroscopic tree is explained in terms of a thermally activated bond-breakdown mechanism. The main results obtained in this study are a novel electrical tree propagation rate equation and a lifetime formula of electrical tree propagation to failure. It has been shown that the proposed new model can give the predicted electrical growth and insulation lives in good agreement with the experimental data of the CT200 epoxy resin.
Keywords :
failure analysis; fractals; organic insulating materials; polymers; trees (electrical); CT200 epoxy resin; electrical tree structures propagation; electrodamage formation; fractal cluster growth; lifetime formula; polymeric insulation; propagation rate equation; quantitative physical model; submicroscopic trees growth; thermally activated bond-breakdown mechanism; Bonding; Dielectrics and electrical insulation; Epoxy resins; Equations; Fractals; Plastic insulation; Polymers; Predictive models; Tree data structures; Trees - insulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
Print_ISBN :
0-7803-7502-5
Type :
conf
DOI :
10.1109/CEIDP.2002.1048950
Filename :
1048950
Link To Document :
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