DocumentCode
2476483
Title
A new model for propagation of electrical tree structures in polymeric insulation
Author
Ding, H.-Z. ; Varlow, B.R.
Author_Institution
Sch. of Eng., Manchester Univ., UK
fYear
2002
fDate
2002
Firstpage
934
Lastpage
937
Abstract
A quantitative physical model for propagation of electrical tree structures in polymeric insulation is presented. In the present model the propagation of trees arises from the formation of electrodamage that precedes and surrounds the tree tip during the tree propagation process. Electrical tree propagation is modeled as the growth of a fractal cluster, which consists of submicroscopic trees. The formation and growth of the submicroscopic tree is explained in terms of a thermally activated bond-breakdown mechanism. The main results obtained in this study are a novel electrical tree propagation rate equation and a lifetime formula of electrical tree propagation to failure. It has been shown that the proposed new model can give the predicted electrical growth and insulation lives in good agreement with the experimental data of the CT200 epoxy resin.
Keywords
failure analysis; fractals; organic insulating materials; polymers; trees (electrical); CT200 epoxy resin; electrical tree structures propagation; electrodamage formation; fractal cluster growth; lifetime formula; polymeric insulation; propagation rate equation; quantitative physical model; submicroscopic trees growth; thermally activated bond-breakdown mechanism; Bonding; Dielectrics and electrical insulation; Epoxy resins; Equations; Fractals; Plastic insulation; Polymers; Predictive models; Tree data structures; Trees - insulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
Print_ISBN
0-7803-7502-5
Type
conf
DOI
10.1109/CEIDP.2002.1048950
Filename
1048950
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