Litton Amecom direct chip attach project

Direct Chip Attach (DCA) is the next logical progression for the electronics industry. DCA, by definition, is the process of attaching the microelectronic die directly to the substrate rather than installing the die inside an electronic package. The benefits are miniaturization, weight reduction, elimination of packaged parts screening, and better electrical performance. Depending on the package configuration and the required I/O, area reductions can range between four and eight times smaller than standard SMT packages and the weight reductions are even better in most cases. DCA also provides the user with greater design flexibility and eliminates the layer of NRE costs associated with multichip module (MCM) and chip scale (CSP) packaging. DCA can be categorized into two approaches: chip-on-board (wire bonding) and flip chip