• DocumentCode
    2476717
  • Title

    P1H-6 Picosecond Ultrasonics as a Helpful Technique for Introducing a New Electrode Material in BAW Technology: The Iridium Case

  • Author

    Devos, A. ; Olivares, J. ; Clement, M. ; Iborra, E. ; Gonzalez-Castilla, S. ; Rimmer, N. ; Rastogi, Ayush

  • Author_Institution
    UMR8520, Lille
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1433
  • Lastpage
    1436
  • Abstract
    We present picosecond ultrasonic characterizations on e-beam evaporated Ir thin films and on AlN films deposited by pulsed DC reactive sputtering on Ir. Picosecond ultrasonics is an optical technique which uses ultrashort laser pulses to generate and detect very short acoustic pulses. We first investigate the properties of the Ir films by measuring samples of various thicknesses and deposition parameters. It permits to extract the longitudinal sound velocity, the acoustic impedance and the acoustic losses in the Ir electrode. Second, we focus on AlN on Ir films. We measure the thickness and the sound velocity of an AlN thin layer deposited on an Ir electrode. This work illustrates how useful the picosecond ultrasonic technique can be for introducing a new material in bulk acoustic wave technology.
  • Keywords
    acoustic impedance; aluminium compounds; bulk acoustic wave devices; high-speed optical techniques; iridium; laser beams; ultrasonic materials testing; AlN; BAW technology; Ir; acoustic impedance; acoustic losses; bulk acoustic wave technology; e-beam evaporated thin films; electrode material; iridium thin films; longitudinal sound velocity; optical technique; picosecond ultrasonics; pulsed DC reactive sputtering; ultrashort laser pulses; very short acoustic pulses; Acoustic measurements; Acoustic pulses; Electrodes; Optical films; Optical materials; Optical pulse generation; Pulsed laser deposition; Sputtering; Thickness measurement; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.360
  • Filename
    4409933