Transforming MMICs

Author

Martinez, E.J.

Author_Institution

DARPA, Arlington, VA, USA

fYear

2002

fDate

20-23 Oct. 2002

Firstpage

7

Lastpage

10

Abstract

In this paper, we describe two new DARPA initiatives addressing new concepts in compound semiconductor materials and architectures that will radically transform monolithic microwave integrated circuits (MMICs) technology to address future requirements for military and commercial sensors and mobile communication networks.

Keywords

MMIC; integrated circuit design; integrated circuit manufacture; intelligent sensors; micromechanical devices; military equipment; mobile communication; optimisation; technological forecasting; DARPA initiatives; MMIC technology development; RF MEMS; compound semiconductor materials/architectures; intelligent RF front-ends; intelligent microsystems; intelligent self-optimization; military/commercial sensors; mobile communication networks; monolithic microwave integrated circuits; Integrated circuit technology; MMICs; Microwave integrated circuits; Microwave sensors; Microwave technology; Military communication; Mobile communication; Monolithic integrated circuits; Semiconductor materials; Sensor phenomena and characterization;

fLanguage

English

Publisher

ieee

Conference_Titel

Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2002. 24th Annual Technical Digest

Conference_Location

Monterey, California, USA

ISSN

1064-7775

Print_ISBN

0-7803-7447-9

Type

conf

DOI

10.1109/GAAS.2002.1049017

Filename

1049017