Title :
Transforming MMICs
Author_Institution :
DARPA, Arlington, VA, USA
Abstract :
In this paper, we describe two new DARPA initiatives addressing new concepts in compound semiconductor materials and architectures that will radically transform monolithic microwave integrated circuits (MMICs) technology to address future requirements for military and commercial sensors and mobile communication networks.
Keywords :
MMIC; integrated circuit design; integrated circuit manufacture; intelligent sensors; micromechanical devices; military equipment; mobile communication; optimisation; technological forecasting; DARPA initiatives; MMIC technology development; RF MEMS; compound semiconductor materials/architectures; intelligent RF front-ends; intelligent microsystems; intelligent self-optimization; military/commercial sensors; mobile communication networks; monolithic microwave integrated circuits; Integrated circuit technology; MMICs; Microwave integrated circuits; Microwave sensors; Microwave technology; Military communication; Mobile communication; Monolithic integrated circuits; Semiconductor materials; Sensor phenomena and characterization;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2002. 24th Annual Technical Digest
Conference_Location :
Monterey, California, USA
Print_ISBN :
0-7803-7447-9
DOI :
10.1109/GAAS.2002.1049017
