• DocumentCode
    2477353
  • Title

    Tsinghua-Johns Hopkins Joint Center for Biomedical Engineering Research: Scientific and cultural exchange in undergraduate engineering

  • Author

    Wisneski, Andrew D. ; Huang, Lixia ; Hong, Bo ; Wang, Xiaoqin

  • Author_Institution
    Johns Hopkins Univ., Baltimore, MD, USA
  • fYear
    2011
  • fDate
    Aug. 30 2011-Sept. 3 2011
  • Firstpage
    3620
  • Lastpage
    3623
  • Abstract
    A model for an international undergraduate biomedical engineering research exchange program is outlined. In 2008, the Johns Hopkins University in collaboration with Tsinghua University in Beijing, China established the Tsinghua-Johns Hopkins Joint Center for Biomedical Engineering Research. Undergraduate biomedical engineering students from both universities are offered the opportunity to participate in research at the overseas institution. Programs such as these will not only provide research experiences for undergraduates but valuable cultural exchange and enrichment as well. Currently, strict course scheduling and rigorous curricula in most biomedical engineering programs may present obstacles for students to partake in study abroad opportunities. Universities are encouraged to harbor abroad opportunities for undergraduate engineering students, for which this particular program can serve as a model.
  • Keywords
    biomedical education; engineering education; further education; research and development; Beijing; China; Johns Hopkins University; Tsinghua University; Tsinghua-Johns Hopkins Joint Center; cultural exchange; international undergraduate biomedical engineering research exchange program; scientific exchange; undergraduate engineering; Biomedical engineering; Cultural differences; Educational institutions; Engineering students; Joints; Laboratories; Academies and Institutes; Baltimore; Biomedical Engineering; China; International Cooperation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
  • Conference_Location
    Boston, MA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4121-1
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2011.6090607
  • Filename
    6090607