Title :
Out-of-plane, high strength, polymer microneedles for transdermal drug delivery
Author :
Chaudhri, Buddhadev Paul ; Ceyssens, F. ; Neves, H. Pereira ; Manna, A. La ; Van Hoof, C. ; Puers, R.
Author_Institution :
Interuniv. Microelectron. Center (IMEC), Leuven, Belgium
fDate :
Aug. 30 2011-Sept. 3 2011
Abstract :
This paper reports on the high strength of high-aspect ratio (>; 50) hollow, polymer microneedles fabricated out-of-plane using a fairly repeatable fabrication process. Further, these microneedle tips were sharpened by a molding principle, with a simple anisotropic etch of silicon wafer. Also, an enhanced elegant process was explored to incorporate the mounting of the microneedle onto a platform without using any additional material, such that the bore of the microneedle is continuous with the bore of the platform in order to facilitate microfluidic delivery through the hollow needles. The high aspect ratio microneedles undergo failure at the critical load of around 4 N, while the insertion force for such a needle into agar gel, which is a fairly good equivalent of the human skin due to its inherent visco-elastic properties, is 7 mN, which translates into a safety factor (ratio of critical loading force to the maximum applied force) of greater than 500 thus, making it adequately strong for skin penetration.
Keywords :
drug delivery systems; microfabrication; microfluidics; needles; skin; anisotropic etching; high aspect ratio polymer microneedles; high strength polymer microneedles; hollow polymer microneedles; insertion force; microfluidic delivery; microneedle tips; molding principle; out of plane polymer microneedles; transdermal drug delivery; viscoelastic properties; Fabrication; Force; Needles; Silicon; Skin; Substrates; Drug Delivery Systems; Injections, Subcutaneous; Microscopy, Electron, Scanning; Needles; Polymers;
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2011.6090622