• DocumentCode
    2477999
  • Title

    P2H-3 Guided Lamb Waves in AlN Free Strips

  • Author

    Benetti, M. ; Cannatà, D. ; Pietrantonio, F. Di ; Verona, E.

  • Author_Institution
    Consiglio Nazionale delle Ricerche, Rome
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1673
  • Lastpage
    1676
  • Abstract
    An electro-acoustic micro-device based on the propagation of guided acoustic Lamb-waves in aluminum nitride (AlN) free strip is described. The AlN thin film was deposited by sputtering technique, optimized to achieve an high degree of orientation (rocking curve FWHM ~ 3.5deg) of the c-axis perpendicular to the plate surface. The AlN beam was micro- machined using anisotropic reactive ion etching (RIE) technique, followed by an isotropic RIE process to remove the silicon underlayer. Simulation results obtained for the dispersion phase velocity curves and the electromechanical coupling coefficient (K-2), are reported. Finally, delay-lines were implemented on the structure and tested for the propagation of the first symmetrical Lamb mode (SO) at the frequency of 1.23 GHz. Measurements are in good accordance with theoretical predictions and show how the structure is suitable for arrays integration of electro- acoustic devices on a single chip for applications to sensing devices and signal processing systems.
  • Keywords
    acoustic delay lines; aluminium compounds; micromechanical devices; sputter deposition; sputter etching; surface acoustic wave waveguides; AlN; AlN free strips; aluminum nitride; anisotropic reactive ion etching; dispersion phase velocity curves; electroacoustic microdevice; electromechanical coupling coefficient; frequency 1.23 GHz; guided Lamb waves; micromachining; sputter deposition; Acoustic beams; Acoustic propagation; Acoustic testing; Aluminum nitride; Anisotropic magnetoresistance; Propagation delay; Silicon; Sputter etching; Sputtering; Strips;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.421
  • Filename
    4409994