Title :
P2H-5 Small 3x2.5mm² Sized Surface Acoustic Wave Duplexer for US-PCS with Excellent Temperature and Frequency Characteristics
Author :
Nakao, Takeshi ; Kadota, Michio ; Nishiyama, Kenji ; Nakai, Yasuharu ; Yamamoto, Daisuke ; Ishiura, Yutaka ; Komura, Tomohisa ; Takada, Norihiko ; Kita, Ryoichi
Author_Institution :
Murata Manuf. Co., Ltd., Kyoto
Abstract :
Using flattened-SiO2/Cu-electrode/36~48deg LiTaO3 structure, small size (5 x5mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO2/Cu- electrode/126~128degYX-LiNbO3, which has larger cou pling factor than above-mentioned substrate, a smaller sized (3x2.5mm2) SAW duplexer with a good TCF has been realized.
Keywords :
copper; flip-chip devices; lithium compounds; multiplexing equipment; personal communication networks; piezoelectricity; silicon compounds; surface acoustic wave devices; Rayleigh SAW propagation; SAW chips; SiO2-Cu-LiNbO3; SiO2-Cu-LiTaO3; US Personal Communication Services; coupling factor; flip-chip bonding process; surface acoustic wave duplexer; temperature coefficient of frequency; Acoustic waves; Bonding; Filters; Frequency; Personal communication networks; Reflection; Substrates; Surface acoustic waves; Temperature; Wires;
Conference_Titel :
Ultrasonics Symposium, 2007. IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4244-1384-3
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2007.423
