Title :
Phase formation and field emission properties of SiC/Si heterostructures formed by MEVVA implantation
Author :
Wong, S.P. ; Chen, Dihu ; Kwok, R.W.M.
Author_Institution :
Dept. of Electron. Eng. & Mater. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Abstract :
High dose carbon implantation into Si with a MEVVA ion source was performed to form SiC/Si heterostructures. By deconvoluting the FTIR spectra into gaussian components corresponding to amorphous SiC and crystalline SiC phases, the implant energy, dose and annealing temperature dependence of phase formation properties of SiC in these structures were studied. It was found that there are critical energies and critical doses at which there are abrupt increases in the fraction of the crystalline SiC phase formed. This was discussed in terms of the ion beam induced crystallization effect. Results of electron field emission measurements showed that a remarkably low turn-on field of about IV/μm could be achieved from these planar SiC/Si structures prepared with appropriate implant and annealing conditions.
Keywords :
Fourier transform spectra; Gaussian distribution; annealing; crystallisation; electron field emission; elemental semiconductors; infrared spectra; interface structure; ion implantation; semiconductor heterojunctions; silicon; silicon compounds; wide band gap semiconductors; FTIR spectra; MEVVA implantation; Si:C; SiC-Si; SiC/Si heterostructures; amorphous SiC; annealing conditions; annealing temperature dependence; critical doses; critical energies; crystalline SiC; deconvolution; dose; field emission; gaussian components; high dose carbon implantation; implant energy; ion beam induced crystallization effect; low turn-on field; phase formation; planar SiC/Si structures; Amorphous materials; Annealing; Carbon dioxide; Crystallization; Electron emission; Implants; Ion beams; Ion sources; Silicon carbide; Temperature dependence;
Conference_Titel :
Electron Devices Meeting, 1998. Proceedings. 1998 IEEE Hong Kong
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-4932-6
DOI :
10.1109/HKEDM.1998.740195