• DocumentCode
    2478800
  • Title

    P3D-6 Simulation, Fabrication, and Characterization of a Novel Flexible, Conformal Ultrasound Transducer Array

  • Author

    Singh, Ram Sevak ; Culjat, Martin O. ; Vampola, S.P. ; Williams, Kresimir ; Taylor, Zachary D. ; Hua Lee

  • Author_Institution
    UCSB, Santa Barbara
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1824
  • Lastpage
    1827
  • Abstract
    A flexible, conformal ultrasound transducer array has been developed for use in medical imaging. The transducer has been designed such that it can wrap conformally around curved body surfaces and provide volumetric imagery of soft tissue and hard tissue structures without mechanical scanning. PZFlextrade, finite element time domain piezoelectric simulation software, was used to model and simulate the curved transducer array in two dimensions. A flexible, conformal transducer array prototype was fabricated, and characterization of the array elements yielded a 15.5 MHz fundamental resonance, a 35% instantaneous bandwidth, and a 300 ns pulse width, resulting in high axial (220 mum in water) resolution. The design and fabrication process allows for scaling of the array to fit various applications, including imaging of the extremities, abdominal imaging, and ultrasound guidance of procedures.
  • Keywords
    biological tissues; biomedical ultrasonics; finite difference time-domain analysis; ultrasonic imaging; ultrasonic transducer arrays; conformal ultrasound transducer array; curved body surfaces; finite element time domain piezoelectric simulation; flexibility; frequency 15.5 MHz; hard tissue structures; medical imaging; soft tissue structures; time 300 ns; volumetric imagery; Biological tissues; Biomedical imaging; Biomedical transducers; Fabrication; High-resolution imaging; Medical simulation; Piezoelectric transducers; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.459
  • Filename
    4410032