Title :
An ensemble of deep neural networks for object tracking
Author :
Xiangzeng Zhou ; Lei Xie ; Peng Zhang ; Yanning Zhang
Author_Institution :
Shaanxi Provincial Key Lab. of Speech & Image Inf. Process., Northwestern Polytech. Univ., Xi´an, China
Abstract :
Object tracking in complex backgrounds with dramatic appearance variations is a challenging problem in computer vision. We tackle this problem by a novel approach that incorporates a deep learning architecture with an on-line AdaBoost framework. Inspired by its multi-level feature learning ability, a stacked denoising autoencoder (SDAE) is used to learn multi-level feature descriptors from a set of auxiliary images. Each layer of the SDAE, representing a different feature space, is subsequently transformed to a discriminative object/background deep neural network (DNN) classifier by adding a classification layer. By an on-line AdaBoost feature selection framework, the ensemble of the DNN classifiers is then updated on-line to robustly distinguish the target from the background. Experiments on an open tracking benchmark show promising results of the proposed tracker as compared with several state-of-the-art approaches.
Keywords :
computer vision; image classification; image coding; image denoising; image representation; learning (artificial intelligence); neural net architecture; object tracking; DNN classifier ensemble; SDAE; appearance variations; auxiliary images; background deep-neural network classifier; classification layer; complex backgrounds; computer vision; deep-learning architecture; deep-neural network ensemble; feature space representation; multilevel feature descriptor learning ability; object deep-neural network classifier; object tracking; online AdaBoost feature selection framework; open tracking benchmark; stacked denoising autoencoder; Boosting; Neural networks; Noise reduction; Object tracking; Robustness; Target tracking; AdaBoost; Boosting; deep learning; deep neural network; visual tracking;
Conference_Titel :
Image Processing (ICIP), 2014 IEEE International Conference on
Conference_Location :
Paris
DOI :
10.1109/ICIP.2014.7025169