Silicon enhanced optoelectronic packaging

There is a growing need for major cost reductions in semiconductor laser diodes, yet it is important that there can be no performance or reliability degradation. Packaging is an extremely important element of semiconductor laser cost due primarily to the added complication of alignment to the optical fiber (often single-mode fiber). This paper discusses some of the ways in which the use of silicon as a packaging platform for semiconductor laser diodes enhances the packaging of these components and how it points the way to an important new class of optoelectronic module integration that we call silicon waferboard. Passive optical alignment, secondary component mounting, elimination of package elements, integration of optical elements, reduction in the number of interfaces and simplification of high performance electronic interconnections are additional benefits that may be achieved through package designs that utilize silicon waferboard mounting